MICROSYSTEMS PACKAGING
AND ASSEMBLY
(C-P-06-2001)
Microsystems require
interfaces to the physical world that are far more complex than those
found in microelectronics. Optical, fluidics, mechanical and electrical
interfaces forces us to reconsider many of the packaging methodologies
we have developed for microelectronics packaging. This course provides
an interdisciplinary overview of the packaging complexities found in microsystems
by surveying established techniques used in microelectronics and revising
current trends in packaging of novel microsystems. Characterization methodologies,
with emphasis in non-contact metrology and various methods for semi-automated
assembly, are also discussed.
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