MICROSYSTEMS PACKAGING AND ASSEMBLY

(C-P-06-2001)

Microsystems require interfaces to the physical world that are far more complex than those found in microelectronics. Optical, fluidics, mechanical and electrical interfaces forces us to reconsider many of the packaging methodologies we have developed for microelectronics packaging. This course provides an interdisciplinary overview of the packaging complexities found in microsystems by surveying established techniques used in microelectronics and revising current trends in packaging of novel microsystems. Characterization methodologies, with emphasis in non-contact metrology and various methods for semi-automated assembly, are also discussed.