INTRODUCTION
TO MICROSYSTEMS ENGINEERING
(C-M-01-2001)
MEMS/MST technology is truly interdisciplinary. Disciplines
such as electrical, mechanical, materials and chemical engineering are
often combined in the development of a novel microsystem. Furthermore,
scientific disciplines such as physics, optics, fluidics, biology, and
biochemistry are also often used as part of a successful microsystem design.
The scaling laws affecting microsystems determine that at the microscopic
level, properties such as surface tension and bonding interaction (stiction)
are far more important than gravity, which becomes negligible. This course
discusses the physics of microdevices, and the fabrication processes available
for producing microsystems. Fabrication techniques such as silicon surface
micromachining, bulk micromachining and deep reactive ion etch for high
aspect ratio microfabrication are introduced. Other techniques such as
plastic microforming, solid free-form fabrication and micromilling techniques
are also discussed.
Package-Centric is
a Service Mark of Memstar Corporation
|
|